1. Develop electrical diagrams, layout and gerbers files for integrated circuits and future projects. 2. Advanced knowledge in using the Cadence and ANSYS tool. 3. Using the concepts of DFT and DFM for Substrate design. 4. Concepts of Signal Integrity. 5. Development of electronic circuits. 6. Failure analysis of the problems found in the products and items developed. 7. Good knowledge about electronic engineering principles with emphasis on analog and mixed signal circuits. 8. Experience with Flash and Integrated Circuit.

1. Bachelor’s degree in Engineering (Computer Science, Electrical, Electronic, or related fields). 2. 4+ years of experience with packaging substrate. 3. Familiar with substrate process, tools and materials. 4. Knowledgeable of process development method. 5. Conduct feasibility studies for various package options and assess designs for manufacturability and reliability. 6. Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities. 7. Fluency in English, with strong communication and documentation skills. 8. Problem solving skills and analytical mindset.