Work experience

• Electronic Design Engineer

  Off-Grid Europe

  2024.07-Current

  (a year)

  • Designing Multi-Layer (up to 8 Layers) PCBs according to IPC Standards using Altium Designer and KICAD. • PCB routing of high-speed components such as high-speed DDR, Nand flash. • Knowledge of proper layout techniques for EMI/EMC compliance. • Contribute to component library development for schematic symbols, part parameters, and footprints • Close work with the design team on component layout and PCB design optimization. • Visual inspection and quality inspection of PCBs according to IPC standards. • PCB Power-Up and Functional Testing. • EMI and EMC Testing of Systems according to MIL-STD-461F. • ESS Testing of Systems according to MIL-STD-810G.
• Senior Hardware Design Engineer

  Crypto Research and Development Center

  2019.04-2024.04

  (5 years)

  (5 years 1 month) • Worked as a Team lead. • Designing Multi-Layer (up to 8 Layers) PCBs according to IPC Standards using Altium Designer, ORCAD Capture and ORCAD Layout. • PCB routing of high-speed components such as high-speed DDR, Nand flash. • Knowledge of proper layout techniques for EMI/EMC compliance. • Contribute to component library development for schematic symbols, part parameters, and footprints • Close work with the design team on component layout and PCB design optimization. • Visual inspection and quality inspection of PCBs according to IPC standards. • PCB Power-Up and Functional Testing. • Designing mechanical enclosures and other CAD models on Solid Works • Integration of Systems by using 3D PCB and 3D Mechanical Model. • EMI and EMC Testing of Systems according to MIL-STD-461F. • ESS Testing of Systems according to MIL-STD-810G. • Managing serial production of multiple R&D projects.
• Hardware Design Engineer

  Pakistan Aeronautical Complex Kamra

  2017.07-2018.06

  (a year)

  • Design PCB and Schematic of different Projects. • Worked on OrCAD Capture and OrCAD Layout. • Worked on Altium Schematic, Layout and 3D Modeling. • Research and Development of MPDR Power System. • Fault diagnostic using Pinpoint Tester.
• RAN Engineer

  ZTE Corporation

  2016.02-2017.06

  (a year)

  (1 year 5 months) • Installation and Integration of the GSM 900/1800, 3G 2100 and 4G 1800 RRU (BTS) Network of ZTE equipment on SCOM and Moblink telecom Projects. • Configuration of CC Cards by using LMT Software. • Swap sites of SCOM and Moblink. • Installation of UBPG (2G), BPK (3G) and BPN (4G) cards. • Responsible for implementation, integration of RRU, BTS and Transmission equipment’s. • Responsible for supervision of Installation of Indoor/Outdoor Units and Microwave Link. • Optima alarm patching. • Alignment of Microwave Dishes of ZTE. • Testing of VSWR and check other alarms by LMT software. • Responsible for the Quality of Sites.

Educational experience

• COMSATS Institute of Information and Technology

  Electrical Engineering

  2012.01-2016.01

  (4 years)

Certificates