Michelle Liu
Hardware Design Engineer@TDK InvenSense
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Summary
Hardware Design Engineer at TDK InvenSense. • System/board level analog/digital circuit design, complex systems including DSP, microcontroller/microprocessor, FPGA, RAM, FLASH, EEPROMs, UART, I2C, SPI, USB, sensors, etc. Strong EE fundamentals • PCB and PCBA Schematic and layout design with Altium • Programming language in Python, C and C++ • Lab skills with oscilloscope, spectrum analyzer, multi-meter, thermal camera, function generator, microscope, power supply, thermal chamber, etc. • Debugging and failure analysis to transfer engineering prototypes to production • ASIC design, transistor level IC circuit design, schematic and layout using Cadence • Post-silicon testing and analysis of fabricated IC with high temperature range using semiconductor wafer probe station and semiconductor logic analyzer and software • Comparator, ADC/DAC, op-amps, sigma-delta modulator, touch sensor readout circuit, filter, shift register design, etc • Embedded system interfacing • MATLAB, Simulink, Allegro PCB, LTSpice and PSpice, • Knowledge in Digital Signal Processing, VHDL, AutoCad drawing, SolidWorks, Radio-frequency Communication, Information Systems • Data analysis, Relational Database, Advanced Excel and Access • Fast learner, bilingual – English and Chinese
Work experience
Hardware Design Engineer
TDK InvenSense2019.08-Current(7 years)Sr. Application Engineer
Innovusion2019.04-2019.07(4 months)Hardware Design Engineer I
Laird2015.03-2017.07(2 years)Research Assistant
The University of Akron2012.08-2014.12(2 years)Proposal Engineer Co-op
ABB2012.01-2012.08(8 months)Teaching Assistant
The University of Akron2010.08-2010.12(5 months)
Educational experience
San Francisco State University
Master of Business Administration - MBA2017.01-2018.01(a year)The University of Akron
Master of Science (M.S.), Electrical and Electronics Engineering2010.01-2014.01(4 years)Sichuan University
Bachelor of Science (B.S.), Electronic Information Engineering2006.01-2010.01(4 years)
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