(1 year 6 months)

(5 years 2 months) Job Synopsis: Involve in probe machine and resolve technical issue on equipment, process and software. Responsibility on perform installation work according to guidelines and procedures. Support engineering activities and submit machine start-up reports according to factory requirements. Support customer production line and help to resolve issue during machine down. Perform teamwork and work closely with other team members. Prepare technical issue report.

Understand about the component of the circuit diagram. Perform I/O assignment check and check the motor driver connect to the Galil Card. Provide daily report include the activities and current status of the machine.

In-charge of DOP process yield improvement and die placement quality improvement. Use JMP or Minitab to determine the process specification limit and process control limit. Perform DOE on critical die parameter to improve the die bonding quality and reduce the manufacturing time. Perform teamwork and work closely with other team members to have a good improvement quality on package. Have perform GRnR and Kappa Study for AVI process on buyoff the new recipe creation. Provide weekly report includes the weekly activities and current issue occurs.

Involved in die attach process. Responsible in setup and buyoff the die bonder machine. Solve technicial issues faced by customer regarding to die bonder machine. Conduct training session and guidelines manual for customer easily catch up the operation of die bonder machine. Support customer production line and guide line technician to get more familiar with the machine. Provide weekly report include the activities and current status of the machine. Machine on field: Flip Chip (AD8312FC), Die Sorter (MS109), Normal DA (AD838, ISLINDA, AD8312PS) and EClip machine (CB830, RO830).