(5 years 2 months) -Leading an engineering and technician team to develop the micro-transfer printing process for microLEDs, microICs, and other devices for our customers -Designing display backplanes compatible with micro-transfer printing, both microLED and OLED -Experience in IC layout for microIC devices -Project Management in a customer-facing role, leading an interdisciplinary team from product requirement discussions through prototype production and testing to delivery

(2 years 4 months) - Continuously improve all aspects of the micro-transfer printing (uTP) process (yield, cycle time) - Design micro-LED displays and other backplanes for uTP processes - Adapt the uTP process to enable new product capability - Develop metrics and analysis methods for uTP processes

-Realized customer requests and drawings as new products for NPI builds -Developed and optimized new processes as needed for NPI requests -Supported Production needs to meet all shipment goals

(4 years 9 months) -Supervised a team of over 20 technicians across 4 shifts performing process development experiments and running a pilot line of new products through a production wafer fab -Primary designer for new products in the chips department -Primary lead for development of new photolithography processes for R&D group -Qualified and transferred new processes on multiple semiconductor tool platforms

-Ran and administrated quality control processes, including coordinating internal and external product testing -Identified and evaluated process improvements in the paper mill and roll conversion processing areas, including a new pulp source product and chemical additive -Evaluated new equipment allowing processing to be expanded to new roll conversion lines