Work experience

• Technical Sales Engineer

  STMicroelectronics

  2024.07-Current

  (2 years)
• Technical Sales Engineer

  Texas Instruments

  2023.10-2024.07

  (10 months)

  ◼◼ Provide customized solution to worldwide key account Delta Electronic’s R&D department, assist on next-generation design to reach better efficiency and performance ◼◼ Discuss RFQ and negotiate the price with Delta’s procurement department ◼◼ Coordinate the supply chain management, act as an interface between the internal production line and buyer from Delta’s worldwide plant ◼◼ Focused end application: Industrial automation/ Power supply in datacenter ◼◼ Focused products: Gate driver, Microcontroller, Digital Signal Processors
• Research Assistant

  Walter Schottky Institute, Technische Universitat Munchen

  2022.12-2023.09

  (10 months)

  ◼◼ Synthesis and characterization of metal oxide thin film semiconductor used in artificial photosystems
• Master Student

  OroraTech

  2021.09-2022.04

  (8 months)

  ◼◼User Requirement Consolidation regarding the market of gas flaring monitoring through CubeSat Satellite ◼◼Commercial Viability Assessment regarding on-Orbit AI-assisted image analysis and thermal imager
• Technical Sales Engineer

  DENSO

  2021.07-2021.09

  (3 months)

  focusing on BMW business branch (Tier-1 Automotive Supplier) ◼◼Support project coordination and sales plan activity ◼◼Conduct market research on potential customer
• Research Assistant

  Technical University of Munich

  2020.10-2021.04

  (7 months)

  ◼◼ Conduct Gleeble to simulate thermal-mechanical behaviors to evaluate heat-affected liquation cracking susceptibility ◼◼ Investigate the hot ductility of different high-temperature alloys Materials Analysis Techniques: Tensile test, Gleeble high temperature tensile test
• Technical Sales Engineer

  Texas Instruments

  2020.07-2020.09

  (3 months)

  Support promoting analog IC to customers in new projects, focusing on industrial application such as power delivery. Help identify the problem in the product supply chain. Do research on the product manufacturing cycle in each phase and make compilation.
• Materials Analyst Intern

  MSSCORPS 汎銓科技

  2018.07-2018.08

  (2 months)

  Conduct sample preparation with FIB and analyze the image with SEM Search the failure of wire-bonding inside the semiconductor with OM and X- ray 學歷

Educational experience

• Technical University of Munich

  Materials Engineering

  2020.01-2022.01

  (2 years)
• Karlsruhe Institute of Technology

  Chemical Engineering

  2018.01-2019.01

  (a year)
• National Tsing Hua University

  Materials Sciences and Engineering (Double major inEconomics)

  2014.01-2018.01

  (4 years)

Certificates