Work experience

• Senior (TCB) Process and equipment Engineer

  Intel Corporation

  2023.09-Current

  (2 years)

  Main responsibility: Tool qualification matrix (TQM) lead OEE (Overall equipment efficiency) lead of module to bench-match with OSAT. Continue taking care of module PSI, collateral management and inventory. Achievements and skills gained: Product fleet qualification enabled with hundreds of hours workload, thousands of materials saving. Giving flexibility on loading plan for manufacturing dept. OEE of module hit goal with 80%. Smart cabinet enabling for great collateral centralized. Sustaining excellence award: Adopt and beat world-class Overall Equipment efficiency on TCB. Sustaining excellence with minimum FSE
• Thermal-compression Bonding (TCB) Process and equipment Engineer

  Intel Corporation

  2021.10-Current

  (4 years)

  Continuously expand module capacity and optimize factory layout by qualification and install new link, coordinate with stakeholders to transfer tool to support VF capacity for VFs as an IQ lead. Project lead to uplift module technical skills through internal self- tool qualification. New product qualification. Collateral management as a PSI rep for module. Achievements and skills gained: 3 continuously Site excellent sustaining awards (SEA). Successfully transferred 2 new high-volume products. AEMT award for collateral fungible as cost saving project. AEMT award for die saving through new approach methodology. Cost shark tank winner with over 1mils saving through Engineer solution. ATM excellent operator with Process optimization to reduce 50% Chronic issue of 2 NPI product. Successful in transferring tool qualification process and up-lifted technical skill/ Data analysis to related stakeholders
• Thermal-compression Bonding (TCB) Process and equipment Engineer

  Intel Corporation

  2020.03-2021.09

  (2 years)

  Main responsibility: Expanding the module volume through rapid ramp new tool installation and qualification as a tool owner. New product introduction Leading technical risk assessments and mitigation plan for new product/ tool issue at TCB process. Taking care of module product supporting items (PSI) as collateral management and module inventory. Achievements and skills gained: Site achievements award for DFIT GPB parts center enabling (Duty free inventory tracking). AEMT award for new TCB CEID config with over 5mils saving. Project management met factory ramping up plan. Data collection through design of experiments for tool qualification. The very first batch of engineer for new product virtual transfer. Plan and management for module collaterals.
• Thermal compression bonding supporting Engineer

  ManpowerGroup

  2019.07-2020.02

  (8 months)

  Supporting on tool installation and data collection for tool qualification. Supporting on product qualification and data collect for new product integration. Taking care of module collateral management and inventory.

Educational experience

• Ton Duc Thang University

  Bachelor‘s degree in Electrical and Electronics Engineering

  2014.09-2019.04

  (5 years)

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