Led project leadership team and engineering team developing single-chip LiDAR system, incl. core module such as. integrated photonics chip, complex photonics & optical assemblies, system hardware and software for proof-of-concept and on-vehicle demo. Directed the engineering project for advanced photonics co-packaging, coordinating multiple suppliers and intricate supply chains to deliver a compact opto-electrical module serving as LiDAR core engine. Served a customer project interface with automotive Tier1 & industry partners inc. Zeiss from kick-off to final closure and achieved committed customer delivery results. Conducted 2D-scanning technology scouting based on photonics chip and engineered its evaluation method incl.optical setup assembly, link budget analysis and prototype demo for full solid-state LiDAR. Created scalable project workflows and identified key interface deliverables among sub-projects from photonics design, chip packaging, system integration to customer release to improve project excution efficiency.

Represented the company as a Technical & Sales interface for automotive OEM customers during RFQ, managing technical presentations, sourcing strategy analysis, cost workshops, negotiations, and nomination processes Collaborated with R&D teams in China to analyze customer requirements and support the development of automotive headlight electronic control units, ensuring compliance with standards and specifications. Facilitated seamless coordination between internal and external stakeholders, ensuring timely delivery of projects and maintaining high customer satisfaction throughout the product lifecycle.