Alexander F.

Dry Etch Process Engineer, Front-End
MalePackaging R&DLive in United StatesNationality
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Work experience

Dry Etch Process Engineer, Front-End

Intel Corporation, Dry Etch
2018.11-Current(7 years)
• Daily high-volume manufacturing sustaining experience with Tokyo Electronics Limited Tactras RLSA systems for multi-nodal processes technology to achieve safety, quality, and velocity indicators. • Conduct equipment qualification and certification for multiple systems for production ramping to achieve factory output threshold. • Utilize data-driven model-based problem-solving to collaborate with key stakeholders in Defect- Metrology and Integration to decide root causes and implement preventive actions to achieve quarterly quality goals and results (e.g., estimated die impact and yield, gap analysis PCSA). • Troubleshoot various technical tool issues using fault detection classification and statistical process control programs, such as Applied Materials E3 and SPC software platforms. • Conduct pilots and written process change technical documents involving nodal fungibility, parts improvement, layer prioritization, and parametric targeting to improve defects and cost savings. • Serve as the lead point of contact for aligning with stakeholder management (e.g., manufacturing fieldservice engineers) to handle specific project requirements, answer niche questions, and tool escalations. • Coordinate with engineers and internal factory sites to enhance and improve equipment and production products through recipe revisions and tool software parameter upgrades and revisions.

Graduate Facilities Assistant

Carnegie Mellon University
2017.06-2018.05(a year)
• Strategized various thin film depositions from PVD techniques including DC/RF sputtering and thermal evaporation on 5- Target NanoFab Sputtering Systems, Perkin Elmer 6J & 8L Sputtering Systems, CVC Connexion Sputtering System, and Ultek E-Beam Evaporator to develop a process line of recipes for extended cleanroom users. • Characterized mechanical and electrical properties such as deposition rate, film stress, and electrical resistivity of processed samples for database recording. RESEARCH EXPERIENCE

Student

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2016.08-2018.05(2 years)
Research Work: Top-Down and Bottom-Up Nanofabrication Techniques on DNA Origami • Designed and fabricated PDMS microfluidics devices through soft lithography to investigate interfacial interactions between DNA origami nanostructures and soft functionalizing substrates for preliminary nanodevices. • Analyzed and validated the integrity of DNA nanostructures using Andor Revolution XD Spinning Disk Microscope for fluorescence imaging.

Graduate Student

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2016.01-2016.05(5 months)
Research Work: Enhancement in the UV Response of Zinc Oxide Tetrapods using RF Sputtered Zinc Oxide Thin Films Enhancement in the UV Response of Zinc Oxide Tetrapods using RF Sputtered Zinc Oxide Thin Films • Fabricated UV-sensitive tetrapod sensors through S1805 photolithography, BCl3 and Cl2 reactive ion etching, sputtering Al and ZnO thin films through RF PVD. • Evaluated IV curves based on 375 nm wavelength by characterization and statistical comparison on Signatone S-1008 to determine sensor performance such as signal enhancement and average current. • Collaborated with a team of colleagues to present project findings in presentation and written documentation.

Undergraduate Researcher

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2011.08-2013.05(2 years)
• Analyzed and formulated several hundred behavioral datasets received from testing paradigms to draw conclusions on the behavioral features of mother mouse during pup retrieval. • Built and confirmed electronic circuits such as an amplifier gain for calibration of ultrasonic microphone and speakers to improve output signal for mouse testing. • Enhanced MATLAB and LabVIEW Fast Fourier Transform segmentation algorithms for executing and recording experiments for added analysis. • Collaborated with UCSF biophysics research groups to achieve research goals in neurological projects. • Presented research progress at various annual college-wide research symposiums and 2012 International Neuroscience Society Symposium to communicate with academic ability in rodent neuroscience.

Educational experience

CARNEGIE MELLON UNIVERSITY

Mechanical Engineering

WASHINGTON UNIVERSITY IN ST LOUIS

Mechanical Engineering

RANDOLPH COLLEGE

Engineering Physics, Minor: Mathematics
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