MI Equipment (MIE) is a Malaysia-based semiconductor equipment manufacturer specializing in die attach, flip chip, and advanced packaging automation systems for global electronics and semiconductor industries Main duties: Supported installation, commissioning, and customer buyoff for die attach and die sort machines,ensuring stable process setup and performance qualification. Troubleshot system issues and conducted root cause analysis to minimize downtime and improve production efficiency. Assisted in NPI and HVM setup, ensuring stable yield, consistent UPH, and smooth transition from prototype to mass production. Provided technical training to customer engineers on operation, preventive maintenance, and troubleshooting. Utilized optical vision systems to inspect die surface quality and detect chipping, contamination,or scratches during sorting and bonding. Collaborated with process and R&D teams to optimize camera calibration, lighting, and image processing parameters for accurate inspection. Monitored equipment performance and analyzed data to identify trends, prevent recurring issues,and enhance yield stability. Supported customer audits and delivered technical presentations ensuring compliance with quality standards. Acted as a technical liaison between customers and internal teams, driving continuous improvement and maintaining a troubleshooting knowledge base.

inspection (AOI), solder paste inspection (SPI), and in-circuit testing (ICT) systems for the electronics manufacturing and semiconductor industries. Main duties: Installed, configured, and optimized SPI, AOI, and X-ray inspection systems at customer sites,ensuring stable performance and accurate defect detection. Performed optical calibration, lighting adjustment, and lens alignment to enhance image quality and detection precision for various components. Fine-tuned inspection algorithms and parameters for glass component surfaces and PCBs to improve detection accuracy, yield, and UPH. Conducted preventive maintenance and diagnostics to ensure system uptime and long-term reliability. Analyzed inspection results and defect data, generated technical reports, and proposed yield and UPH improvement solutions. Provided technical training to customer engineers on defect classification, system operation, and inspection reporting. Collaborated with global teams (Korea, Japan, China, Taiwan, Europe, and the US) to resolve technical issues and support continuous software and feature improvements. Supported sales and application teams with technical consultations, demos,and feedback for product enhancement and customer satisfaction.

Main duties: Installed and calibrated SMT pick-and-place machines. Conducted preventive maintenance and repaired system failures. Troubleshot hardware/software issues to maintain stable production. Implemented upgrades to improve machine efficiency. Provided technical support and prepared service reports for customers.

industries Main duties: Conducted mold research and improvement to reduce defects, improve part quality, and enhance productivity while minimizing labor and material costs. Designed and programmed jigs, slides, and mold components using AutoCAD and NX software, ensuring high precision and manufacturability. Managed mold machining, fabrication, and assembly processes, supervising tooling setup, repair,and preventive maintenance activities. Performed quality control inspections after mold repair or manufacturing to ensure conformance with design and process standards. Planned equipment maintenance schedules and coordinated corrective actions for breakdown recovery. Managed team workloads, assigned daily tasks, monitored resource usage, and prepared performance reports for management.