(5 years 5 months) - Develop new process and recipe, which involving new machine buyoff or machine upgrade, to realize new LED product concept into high volume manufacturing. - Major development is in Automotive business unit. - Create Purchase Specifications, machine comparison, CoO and CapEx for purchasing new/upgrade equipment - Buyoff new machine, efforts including Calibration, MSA, GR&R, Linearity & Bias Correlation Study, Control Plan, PFMEA, Workability Report, Work Instruction, Maintenance Instruction with PM Checklist, process yield validation, training provision, EHS & ESD assessment and SECS/GEM integration - Responsible in design for manufacturing (DFM) in new equipment design & selection, and process sequence/flow for new product - Create Failure Catalogue - Good knowledge in E142 and SECS/GEM integration for equipment - Solve production issue for new mass run defect

6 years 2 months (2 years 3 months) - R&D process owner for all below processes (over the years): i) Wafer Level: a. Automated Optical Inspection : 2D AOI / AVI b. 6D AOI / AVI (Six Sided) with Pick and Place System for Bin Sorting c. Die Attach (Bare Die) d. Grinding Wafer e. Pick and Place (Bin Sorting) f. Wafer Transfer/Flipping Technologies g. Measurement (Nikon and Mitutoyo machines) ii) PCB Level: a. Components Attach in SMT line for LED module b. Masking (Dispensing) c. Lens Attach d. Measurements (Nikon and Mitutoyo machines) - Mainly developed LED for both Flash and Automotive business unit. - Trained, led and supervised a group of >4 engineers and >12 technicians in execution of automotive and flash business unit projects. - Practiced Six Sigma manufacturing using JMP/Minitab. - Defined data collection methodology, managed trainings for processes and troubleshooting. - Participated in design review for new projects, include DRBFM. - Coordinated problem-solving for technical-related issues across different work functions to meet project milestones. - Created Control Plan, Process Potential Failure Mode & Effect Analysis (PFMEA), Requirements for Process Step Release (RPR), and Operating Instruction(OI) for new/existing projects.

Developed new processes for both Flash & Automotive LED Chips (WaferLevel).

(1 year 11 months) Part of pioneer team member to setup new SMT line (PCB Form) processes in company for a world leading fruit-themed smartphone's Flash Module.

- Generated Assembly Build Instruction (ABI) for all new transfer project from Europe - Raised Quality Notice (QN), stored rejection details and updated Honeywell Defect Part per Million (DPPM) for several projects upon receiving complaints from the customers - Assisted engineers to prepare documents for shipment (Full or Delta FirstArticle Inspection Report), compiled yield report, performed rescreen and purge activity, verified board history, traceability for Label Request, data and other ad-hoc quality related matters