Work experience

• Engineering Manager

  Rapid Manufacturing Connectivity

  2023.06-Current

  (2 years)

  Lead NPI department for Cable & Harness assembly process. Drive NPI manufacturing leads time to meet the customer schedule. Drive daily operation and engineering issue. HMLV (High Mixed Low Volume), Monthly 300~ 400 NPI models. Daily operation meeting with senior management and global team. Involve from product RFQ and technical advice to Global Quote Team. CTQ for new terminal’s crimping process, applicator and equipment. ACCOMPLISHMENT: Improved NPI yield from 70% to 94%. Qualified first box build project. (ENOVIX, AMAT) Improved efficiency and overall warehouse layout. Qualified Semicon and Aerospace product from oversea to MYS. Skill matrix development for NPI team.
• Snr. Operation & Engineering Manager

  FASTRAIN TECHNOLOGY SDN. BHD.

  2021.04-2023.06

  (2 years)

  Lead Plant 1 and Plant 2 manufacturing sector and local employees. Direct report to HQ Vice President. Manage manufacturing, warehouse, engineering and facility department. (300 HC) Improve total 4 SMT lines efficiency and UPH improvement. Improve backend PCBA process & HLA process. Project transition and machine transferred from HQ. Review monthly forecast to revisit bottleneck process and headcount fulfillment. Work with HQ finance to review manufacturing PNL. (Plan VS Actual) Review daily shipment plan and work order aging. Involve new business development and RFQ process. Plan for CAPEX and budget allocation for each improvement project. Review ECN, DFM improvement from ENG department. Coordinate PM schedule, spare part management, equipment buy-off. ACCOMPLISHMENT: Pioneer to setup new plant in FASTRAIN MYS. (Plant1&2) Qualification total 4 SMT Siplace lines and backend machines. Project transition ODM Marine products from HQ. (High Level Assembly) Qualified high complexity PCBA for Coherent Project. (100G, 200G, 400G and 800G) Qualified ACCELINK, HG Tech and ATOP optical transceiver product. (6G, 10G, 25G) Qualified EMCORE laser pump with manual wire bonding process. DFM improvement on 01005 soldering issue. Improve 40% SMT UPH and increase line’s capacity. Sustain SMT yield above 99.5%.
• Staff Product Engineer

  Plexus Manufacturing Sdn Bhd

  2015.06-2021.04

  (6 years)

  Lead product and process engineering team across focus factory projects. (Max: 12 Projects) US Customer: LeCroy Teradyne, Teradyne TAI, IMPINJ, CalAMP Canda Customer: CPI, AB Sciex Australia Customer: MINELAB, CODAN, MINETEC, Ventia Improve product quality and sustain FPY above the goal. Setup new customer project and prototype build. Produce DCS document for manufacturing guideline or work instructions. Coordinate VSM project, TAKT time simulation and design the manufacturing layout. Provide technical support and DFM solution to customer. Co-work with MTD team and FA Lab department for failure analysis project. Utilize quality tool for problem solving. (5 Why's, Ishikawa & 8D) Failure analysis on PCBA defects and cross section analysis. Develop process and drive process cycle time to meet forecast demand. FAI process validation with cross section, strain test, humidity test, temperature cycle and drop test. Define NPI process flow and maintain process router in MES system. Qualify new equipment, safety buy-off, process validation. Lead PPQP & PFMEA for NPI build. ACCOMPLISHMENT: Setup IC de-marking project by 20 watts laser machine. Setup Hybrid torque for Impinj project. Setup PVA conformal coating & underfill machine. (Dual application) Implementation of Auto Soldering project. Setup Global digital manufacturing project. (Fanuc 6 Axis cobotx2units) Implementation of SMT Pin in Paste process. CalAmp product transfer from Plexus Xiamen. Successful launching MINELAB Vanquish product from prototype to mass production. Successful launching IMPINJ X-Span product from prototype to mass production. Improved RF stealth Antenna project. Support internal pFMEA training.
• Senior Manufacturing Engineer

  Jabil Circuit Sdn Bhd

  2014.07-2015.07

  (a year)

  Lead ME department for LAM Research project. Manage ME Engineer, ME Technician and Visual Aid Technician. (20 HCs) Weekly conference meeting with Lam customer/ remote customers. Review the failure analysis report and 8D report prior submission to customer. Drive OEE improvement project. SMT Line capacity measurement and improvement. 4Q improvement to drive First Past Yield. ACCOMPLISHMENT: Implementation of Hybrid torques across HLA products. Implementation of MES scanning for PLV (Part Line Verification) Successfully setup Mascot Visual Aid for manual insertion process. Monthly operation review (MOR) with customer and senior management.
• Process Engineer II

  Plexus Manufacturing Sdn Bhd

  2011.03-2014.06

  (3 years)

  Troubleshooting daily process related issue in production. Design NRE tooling to support NPI build. (Stencils, Pallets, Jig fixtures) Data package review to setup HLA/ PCBA process control flow chart for prototype build. Produce assembly build instruction to production with refers to assembly drawing from customer. Control product revision via MAX/GSF system. HLA Line capacity measurement to develop value stream mapping. Capable to produce DMAIC/ DFM/ FMEA/ DOE report. Buy-off SMT reflow profile and wave reflow profile. Attend conference call with overseas customer to enclose the weekly OIL list. Troubleshoot quality issues for yield improvement. ACCOMPLISHMENT: Product transferred from Adelaide, Australia for MINELAB CTX3030 metal detector product. Product transferred from Adelaide, Australia for CODAN MINIBUC RF product. Product transferred from Adelaide, Australia for CODAN F3 military product. Known well of conformal coating process and epoxy coating process. Setup air leakage tester and equipment. Setup laser engraving machine for component ID de-marking process. Setup automated conformal coating spraying machine.
• Manufacturing Engineer

  Jabil Circuit Sdn Bhd

  2009.08-2011.03

  (2 years)

  Work as manufacturing engineer to monitor sustaining products from Agilent Japan. Buy-off reflow profile and wave profile for FA build. Take care of tooling maintenance and tooling modification. Submit monthly KAIZEN for saving. Attended internal quality call for RCCA. Visual aid creation and enhancement. ACCOMPLISHMENT: Experience in PCBA related software: VALOR and GC Preview. Competent in using EMS system: MES, AGILE and SAP. Learn cleanliness control for HI-Z rank product. Total FA models completions: 220 .

Educational experience

• Universiti Tunku Abdul Rahman

  Bachelor of Engineering (Electrical/Electronic) (Electronic Communication Engineering)

  2005.09-2009.07

  (4 years)
• College TAR

  Diploma of Engineering (Electrical/Electronic) (Electronic Engineering)

  2004.09-2006.07

  (2 years)

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