Summary

Work experience

• Application Engineer

  DISCO HI TEC VIENAM

  2023.04-Current

  (3 years)

  Working Place: Vietnam Main responsibilities: • Perfrom the installation, optical check&adjust, recipe optimization to support, ensure satisfaction and equipment reliability across Japan, Korea, and China clients at Vietnam. • Collaborated with Singapore and Japan HQ for troubleshooting and performance reports. • Supported pre-sales and post-sales technical activities for advanced laser and optical systems used in semiconductor manufacturing. • Applied “Jobs-to-be-Done” (JTBD) theory to understand customer processes beyond standard machine operation, enabling more effective technical proposals and application improvements. • Independently proposed and presented continuous improvement ideas through internal innovation programs, including regional-level evaluations with Singapore teams. • Conducted on-site demonstrations, customer training, and technical presentations for international clients (Japan, Korea, USA, China, Singapore). • Provided training, progress tracking, and process improvement proposals. • Support customers at another countries (ThaiLand, Singapore).
• Engineer

  DISCO HI TEC JAPAN

  2022.09-2023.03

  (7 months)

  Working Place: Japan Main responsibilities: • Assemble the mechanical and electrical parts. • Install and adjust the optical axis. • Check and adjust machine's software, function and errors. • Perform Test Cut (Recipe Optimization) for customer wafers. • Prepare and check the packing list for shipping. • Conduct final check. Achievements and skills gained: • Deeply grasp about laser and optical axis. • Encountered and succeed to optimize recipes to cut wafers. • Improve trouble-shooting skills. • Detailed checking for all working process.
• Application Engineer

  DISCO HI TEC SINGAPORE

  2022.03-2022.06

  (4 months)

  Working Place: Singapore Main responsibilities: • Get the deeply training on Laser Machine (DOE, Report, Test Cut, etc). • Visit and support customer working in semicondutor field at Singapore. Achievements and skills gained: • Adjust the optical axis. • Install the laser machine. • Apply the application for laser machine into cutting wafer. • Troubleshooting. • Deal with Singaporean customer with their needs.
• Application Engineer

  DISCO HI TEC VIENAM

  2021.06-2022.02

  (9 months)

  Working Place: Vietnam Main responsibilities: • Get the training about the machines (Dicer, Grinder, Laser) at Vietnam. • Visit customer working in semicondutor field at North Side of Vietnam. Achievements and skills gained: • Gained knowledge about the semicondutor (wafer, front-end & back-end process, ...ect) • Making plans to visit and work with customer
• Engineer

  NISSAN AUTOMOTIVE TECHNOLOGY VIET NAM COMPANY LIMITED

  2020.03-2021.04

  (a year)

  Working place: Vietnam Main responsibilities: - Sketch and Modify the model of the auto's outline, especially for Grille and Bumper. - Analyse the cooling (Radiator, Air-Guide...) and aerodynamics function through the air. - Calculate and issue result. - Check the results as the requirement (correct the errors if any). Achievements and skills gained: - Be capable of leading small team (delegating and managing the tasks). - Improve Teamwork and Independent working skills. - Enhance the solving-problem skills. - Capable of managing and prioritizing my own workload. - Ability to present reports in a clear and concise way. - NX-CAD, Space Vision, Ansa, NDCV...

Educational experience

• Hanoi University of Industry

  Mechanical Engineering Technician

Languages