1. Performed server rack integration testing for high-performance computing and AI systems (e.g., GB200/GB300), ensuring full functionality before shipment. 2. Performed debugging on server node and rack-level issues by analyzing system logs, firmware logs, and test outputs to help isolate root causes. 3. Supported coordination of testing schedules and monitored shipment timelines to align with project milestones and customer requirements. 4. Collaborated with suppliers to identify, analyze, and resolve hardware and firmware bugs throughout the testing process. 5. Communicated with customers in technical discussions, documenting requirements, reporting progress, and tracking issues.

(1 year 3 months) 1. Next-Gen AI Platform Lead: Specialized in board-level FA and diagnostics for NVIDIA (GB200/GB300) and AMD (MI300/MI325) platforms, ensuring 24/7 stability for development environments. 2. Root Cause & Signal Integrity: Handled the "tough" failures—performing component-level diagnostics, BGA reflow validation, and power integrity checks to isolate hardware faults. 3. Rapid Infrastructure Deployment: Scaled a validation environment from the ground up (48 mainboard / 12 system stations), achieving early customer approval for two FAI programs within 3 months. 4. Standardizing Excellence: Authored the troubleshooting guides and SOPs used across the production line, improving defect detection effectiveness by 5%. 5. Mentorship: Personally trained a team of 10+ engineers to maintain high diagnostic standards across motherboard and chipset platforms.

Chip bumping、probing and assembly processes learning. MES system and Seven Basic Tools of Quality Control learning. Support engineer in R&D sample production.