Hiroshi Hiraga

Senior Field Application Engineer@NXP Semiconductors | Field Application Engineer@Freescale Semiconductor
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Summary

Senior Field Application Engineer -NXP Semiconductor. Started working for National Semiconductor Japan as FAE, being in charge of RF products including PLL and Bluetooth. And had experienced micro-processor and flash memory application support for mobile in Intel. Moved over Netherlands and belonged to cordless phone market as Product application engineer at SiTel Semiconductor. 16 years in semiconductor field including Digital and Analog products. Widely experienced in wireless applications. 3 years for Application Engineer, 13 years for Field application engineer. Specialities: Embedded baseband and processor's software support using C code. Recommendation to schematics and layout. Working closely with headquarter business unit to tackle technical issues. Handling customer's complaints and requirements.

Work experience

  • Senior Field Application Engineer

    NXP Semiconductors
    2015.12-Current(11 years)
  • Field Application Engineer

    Freescale Semiconductor
    2013.08-Current(13 years)
  • Senior Field Application Engineer

    Dialog Semiconductor
    2011.07-2013.06(2 years)
  • Senior Product Application Engineer

    SiTel Semiconductor
    2004.09-2011.07(7 years)
  • FAE

    Intel Corporation
    2003.09-2004.09(a year)
  • FAE

    National Semiconductor
    1997.04-2003.09(6 years)

Educational experience

  • 明治大学 / Meiji University

    Bachelor of Arts (B.A.), Mechanical and Electronics Engineering
    1993.01-1997.01(4 years)
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