Requirements1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science or equivalent2) Min 3 years' experience in Discrete or Module semiconductor die attach or SMT engineering using ASM, ESEC, Yamaha(SMT), Datacon, others die bonder or SMT machine experience3) Solder and epoxy material properties and its reliability failures knowledge 4) JMP, Minitab DOE or other statistical analysis skill will get advantages5) Be familiar with design, process FMEA, Control plan generation6) In-depth knowledge of power electronic packages and processes7) Fundamental understanding of package design and material properties8) Knowledge of power packages processes 9) Understanding of semiconductor material properties and their influence on semiconductor device behavior10) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired11) Excellent interpersonal, verbal, and written English communication skills12) Ability to demonstrate great attention to detail13) Are a proven self-starter

Job description1) Responsible from design review of new products, participate Packageand substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time3) Lead supplier to design required tools and jig such like magazine, spanker, stencil, epoxy dispensing nozzle4) Characterize and generate report for solder, epoxy, SMT process against failure modes and key parameters of output variables according to D/PFMEA5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department6) Validate design rule by process characterization 7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation8) Resolve technical issues from characterization, qualification, and customer samples9) Owner of correspond process to meet required process success criteria10) Generate new equipment PO spec leading cross functional team from operation and support department